Semiconductor cleaner systems and methods

ABSTRACT

In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., &lt;10 −6  Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

This application claims priority from U.S. provisional patentapplication Ser. No. 61/500,608, filed on Jun. 23, 2011, entitled“Semiconductor cleaner systems and methods” which is incorporated hereinby reference.

BACKGROUND

The production of semiconductor components requires cleanliness, such ascontrol of particles, impurities, or foreign matter. The presence ofthese particulates can affect the yield of good devices within theprocessed wafers. Thus the transport of these wafers is typicallycarried out in special transport container, such as cassettes, carriersor trays, as well as closable or sealable containers or boxes, includingFront Opening Unified Pod [FOUP], Front-Opening Shipping Box [FOSB],Standard Mechanical Interface [SMIF] pods or boxes. The FOUP typicallypossesses comblike guidance at two facing long sides for supporting thewafers, and can be closed with a removable cover. Without the cover theFOUP is a hollow container having a pot-like basic form with arectangular surface area. In addition to wafers, reticles are alsostored in reticle carriers, which are stored in a reticle stocker. Thereticle carriers are transported to the lithography tool when needed formask exposure.

The FOUPs and reticle carriers need to be cleaned occasionally tomaintain the standard of cleanliness required in processingsemiconductor wafers. The cleaning process can be performed in specialcleaning and drying equipment. With increasing requirements forcleanliness, the number of cleaning cycles in the modern semiconductorfactories rises, together with increased requirements for cleanliness.For example, it is desirable to clean a FOUP after each individual usein order to prevent, for example cross contamination from one wafer loadto the next.

Thus it is desirable to shorten the time needed for a complete cleaningof the FOUPs. Furthermore, it is also desirable to keep cleaningconsumption as small as possible, especially in view of the increasedcleaning cycles. On the other hand, the cleaning must be very thoroughin order to fulfill the cleanliness requirements of modern semiconductorfactories.

SUMMARY

In an embodiment, the present invention discloses a cleaner system andprocess for cleaning a workpiece, such as a carrier. The cleaner systemcomprises at least one of separate dirty and cleaned environments,separate cleaning chambers for different components of the doublecontainer carrier, gripper arms for picking and placing differentcomponents using a same robot handler, gripper arms for holdingdifferent components at different locations, horizontal spin cleaningand drying for outer container, hot water and hot air (70C) cleaningprocess, vertical nozzles and rasterizing megasonic nozzles for cleaninginner container with hot air nozzles for drying, separate vacuumdecontamination chambers for outgassing different components, forexample, one for inner and one for outer container with high vacuum(e.g., <10⁻⁶ Torr) with purge gas, heaters and gas monitor (e.g., RGAsensors) inside the vacuum chamber, purge gas assembling station, andpurge gas loading and unloading station.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary configuration of a EUV reticle carrierto be cleaned.

FIG. 2 illustrates an exemplary configuration of a cleaning systemaccording to an embodiment of the present invention.

FIGS. 3A-3C illustrate different configurations for a cleaner systemaccording to an embodiment of the present invention.

FIGS. 4A-4B illustrate exemplary flow configurations for a dirty and acleaned environments according to an embodiment of the presentinvention.

FIGS. 5A-5B illustrate exemplary configurations for purging the cleaningchamber according to an embodiment of the present invention.

FIGS. 6A-6B illustrate exemplary flowcharts for cleaning objects usingseparate dirty and cleaned environments according to an embodiment ofthe present invention.

FIG. 7 illustrates another exemplary cleaning process using separatedirty and cleaned environments according to an embodiment of the presentinvention.

FIGS. 8A-8B illustrate exemplary separate cleaning chambers fordifferent components of an object according to an embodiment of thepresent invention.

FIG. 9 illustrates an exemplary cleaner system using separate cleaningchambers for different components of an object according to anembodiment of the present invention

FIGS. 10A-10B illustrate exemplary flowcharts for cleaning objects usingseparate cleaning chambers according to an embodiment of the presentinvention.

FIG. 11 illustrates an exemplary flowchart for separately cleaningobjects using separate cleaning chambers according to an embodiment ofthe present invention.

FIGS. 12A-12B illustrate an exemplary robot gripper according to anembodiment of the present invention.

FIGS. 13A-13C illustrate exemplary gripping configurations of thegripper arms according to an embodiment of the present invention.

FIGS. 14A-14B illustrate exemplary flowcharts for gripping objects usingthe present gripper arms according to an embodiment of the presentinvention.

FIG. 15 illustrates an exemplary flowchart for separately cleaningobjects using separate cleaning chambers according to an embodiment ofthe present invention.

FIGS. 16A-16C illustrate exemplary cleaning sequence of an objectaccording to an embodiment of the present invention.

FIGS. 17A-17B illustrate exemplary flowcharts for cleaning objectsaccording to an embodiment of the present invention.

FIGS. 18A-18C and 19A-19B illustrate an exemplary cleaning chamberemploying ultrasonic or megasonic liquid spray according to anembodiment of the present invention.

FIGS. 20A-20B illustrate exemplary flowcharts for cleaning objectsaccording to an embodiment of the present invention.

FIG. 21A illustrates an exemplary decontamination chambers according toan embodiment of the present invention.

FIG. 21B illustrates another exemplary decontamination chambersaccording to an embodiment of the present invention.

FIGS. 22A-22B illustrate exemplary flowcharts for decontaminatingobjects according to an embodiment of the present invention.

FIGS. 23A-23B illustrate exemplary assembling station and processesaccording to an embodiment of the present invention.

FIGS. 24A-24B illustrate exemplary flowcharts for assembling objectsaccording to an embodiment of the present invention.

FIG. 25 illustrates an exemplary transfer and/or storage station havingpurge nozzles according to an embodiment of the present invention.

FIGS. 26A-26B illustrate examples of a cleaner according to someembodiments of the present invention.

FIG. 27 illustrates an example of a hybrid cleaner system according tosome embodiments of the present invention.

FIG. 28 illustrates an example of a cleaner system according to someembodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention discloses methods and apparatuses for integratedcleaning of objects, such as semiconductor workpiece containers andreticle carriers. The cleaning process can include liquid cleaning,drying, and vacuum decontamination.

Cleaning methods consist of ways to remove particles and/orcontamination such as organic, inorganic metals, native oxide andparticulate matters as well as removing water spots. Cleaning can be acritical requirement for semiconductor articles such as cassettes, FOUP,holders, carriers, etc. In the cleaning process, removal of particles inthe range of few microns down to sub-micron levels and reduction oftrace contaminants (metals or ions) have become part of the concerns ofsemiconductor cleaning industry.

The cleaning process can provide effective object cleaning with minimumliquid residue, which can assist in the subsequent drying process. Forexample, the article to be cleaned is positioned with minimum liquidtraps, such as on horizontal or vertical surfaces. In addition, atpotential trap locations, gas nozzles can be located to blow away anytrapped liquid to help in minimizing liquid residue and assisting thedrying process. Gas nozzles preferably provide nitrogen or filtered air,but can also provide liquid or aerated liquid. In an aspect, gas nozzlescan perform cleaning action, and liquid nozzles can remove trappedliquid.

In an embodiment, the present invention discloses cleaning processes andsystems for high level cleanliness articles, such as extreme ultraviolet(EUV) reticle carriers. The following description uses EUV reticlecarriers are example, but the invention is not so limited, and can beapplied toward any objects having stringent cleanliness requirements,such as low particulate contaminations and low outgassing components.

FIG. 1 illustrates an exemplary configuration of a EUV reticle carrier79 to be cleaned. A EUV reticle 70 is typically stored indouble-container carrier 79, together with having nitrogen in the space77 between the inner container and the outer container. An innercontainer is typically made of metal, comprising an upper lid 71 matedwith a lower support 72. An outer container is typically made of lowoutgassing polymer, comprising an upper lid 73 mated with a lowersupport 74. Both containers can have handles for holding by an operatoror by an automatic transport system. A handle 75 is shown for the upperlid 73 of the outer container. The support 74 of the outer container canhave inlets for accepting nitrogen purge to the inner volume 77 of thereticle carrier.

The double container euv reticle carrier is an example of the high levelof cleanliness for semiconductor processing, where the reticle is storedin two levels of container to prevent contamination. In addition, thevolume between the two levels is purged with nitrogen to avoid bacteriagrowth, or to prevent outgassing particles from the outer container toattach to the inner container. Thus a cleaner system for such cleanedobjects requires improved features to maintain the desired level ofcleanliness after being cleaned.

In an embodiment, the present invention discloses separating a dirtyenvironment before cleaning with a cleaned environment after cleaning.The separation can maintain the cleanliness of the objects after beingcleaned, for example, by preventing the cleaned objects from beingcontaminated with contaminants in the dirty environment. In thefollowing description, the term “dirty” is used to indicate arelationship to the term “clean”, and is meant to indicate a less cleanenvironment. For example, an object can be dirty, e.g., in need ofcleaning, in term of cleanliness levels required in semiconductorprocessing, and not of everyday operation. After cleaning, the objectcan be clean, e.g., cleaner than before, when the object is in the dirtystate.

In an embodiment, the cleaner system comprises one or more cleaningchambers with separate input and output ports to communicate withseparated dirty environment and cleaned environment. For example, acleaning chamber has an input port coupled to a dirty environment foraccepting object to be cleaned. The cleaning chamber also has a separateoutput port coupled to a cleaned environment for transferring theobjects after being cleaned in the cleaning chamber to a cleanedenvironment. The cleaning chamber thus separates the cleaner system intoan input dirty environment and an output cleaned environment. The inputand output ports of the cleaning chamber are synchronized to preventcross contamination between the dirty and the cleaned environments. Forexample, only one port is open at one time to prevent dirty air in thedirty environment from entering the cleaned environment. In anembodiment, the cleaning chamber has cleaned purge gas (either cleancompressed air or nitrogen) before opening the output port to thecleaned environment. In addition, a positive pressure can be establishedin the cleaning chamber before opening the input port to the dirtyenvironment, thus minimizing any backflow of dirty air from the dirtyenvironment. A negative pressure can be established in the cleaningchamber before opening the output port to the cleaned environment, thusminimizing any backflow of dirty air to the cleaned environment.

In an embodiment, different loading ports can be used. For example,input loading ports are used in dirty environment for accepting objectsto be cleaned. Separate output unloading ports are used in cleanedenvironment for outputting cleaned objects. Further, different robothandling systems can be used. For example, a dirty robot is used in thedirty environment and a separate cleaned robot is used in the cleanedenvironment.

Different levels of cleanliness can be established in the dirty andcleaned environments. For example, the dirty environment can have filterlaminar flow. The cleaned environment can have improved cleanliness, forexample, filtered recirculated air or nitrogen flow with raised floorand chiller. The recirculation of flow in the cleaned environment canisolate the cleaned chamber from the outside ambient, thus minimizingany possible contamination from outside air. A chiller can be installedin the recirculation path, cooling the air or nitrogen flow andpreventing thermal agitation of air molecules.

In addition, a clean air curtain comprising fans at a top ceiling andfans at a bottom floor at the interface with the output port of cleaningchamber can further isolate the cleaned environment from any potentialconnection with the dirty environment.

In an embodiment, the serviceable components are preferably located indirty environment to minimizing access to the cleaned environment, thuskeeping the cleaned environment as clean as possible.

FIG. 2 illustrates an exemplary configuration of a cleaning systemaccording to an embodiment of the present invention. A cleaning chamber14 separates the dirty environment 12 from the cleaned environment 16,with a dirty robot 12B and an input loading port 12A located in thedirty environment 12, and a cleaned robot 16B and an output unloadingport 16A located in the cleaned environment 16. In a typical workpieceflow, a object to be cleaned, such as a euv reticle carrier, is loaded11 to the input loading port 12A, then is transferred 13 by the dirtyrobot 12B to the cleaning chamber 14. After being cleaned in thecleaning chamber 14, the cleaned object is transferred 15 by the cleanedrobot 16B to the output unloading port 16A to be unloaded 17. Thecleaning chamber can have separate input door and output door, with thedirty object entering the dirty input door 13, and the cleaned objectexiting the clean output door 15. Further considerations can be includedto prevent cross contamination between the clean and dirty environment.For example, higher pressure can be established in the clean environmentduring the transfer of the clean object to generate a laminar flow awayfrom the clean environment, minimizing particles backflow from the dirtyenvironment. In addition, isolation can be established between the cleanand dirty environment, for example, by interlocking the cleaning chamberdoors, preventing the input door and the output door to be open at asame time.

FIGS. 3A-3C illustrate different configurations for a cleaner systemaccording to an embodiment of the present invention. In FIG. 3A, thedirty environment 22 and the cleaned environment 26 are locatedside-by-side with the input loading port 21 and the output unloadingport 27. An input loading door 21A is first opened to accept a dirtyobject to the input loading port 21. After closing the input loadingdoor 21A, the output loading door 21B is opened, and the dirty objectcan be picked up by the dirty robot. After closing the output loadingdoor 21B, the input chamber door 24A is opened, and the dirty object canbe transferred to the cleaning chamber 24. After cleaning, the objectcan be transferred to the output chamber door 24B, which is then openedso that the cleaned object can be picked up by the cleaned robot. Thecleaned object is then transferred to the output unloading port 27 andthen to the outside ambient through the doors 27B and 27A.

FIG. 3B illustrates another configuration where the cleaning chamber 24has two opposite input door 24A and output door 24B. FIG. 3C illustratesanother configuration where the cleaner system has a number of cleaningchambers, where two cleaning chamber 24′ and 24″ are shown. Linearguides 22B and 26B in dirty and cleaned environments, respectively, cantransport dirty and cleaned robots 22A and 26A, respectively, to andfrom different cleaning chambers 24′ and 24″.

In addition to the separation of environments before cleaning and aftercleaning, the environments can be maintained at different cleanliness.For example, at the input section where the object is dirty, a dirtierenvironment can be established. At the output section where the objecthas been cleaned and thus is cleaner, a clean environment can beestablished.

FIGS. 4A-4B illustrate exemplary flow configurations for a dirty and acleaned environments according to an embodiment of the presentinvention. FIG. 4A illustrates a laminar flow 32B in dirty environment32, passing through the filter system 32A. Electronic equipment 31 canbe located in the dirty environment 32, which can be accessed throughservice door 30. The cleaned environment 36 has recirculating flow 36B,passing through raised floor 37, entering chiller 38, and filtered byfilter system 36A. The closed environment can isolate the cleanedenvironment 36 from the outside ambient, further improving thecleanliness of the cleaned environment. Sandwiching between the twoenvironments 32 and 36 is the cleaning chamber 34, which comprises purgegas inlet 35A and purge gas outlet 35B.

FIG. 4B illustrates an exemplary curtain gas flow for the cleanedenvironment according to an embodiment of the present invention. A fansystem 39C is located in front of the output port of the cleaningchamber, thus modifying the flow 39B in the cleaned environment, so thata curtain flow is established at the output door 34B. This curtain flowcan minimize any back flow from the cleaning chamber 34, thus preventingany cross contamination to the cleaned environment.

In addition to maintaining different levels of cleanliness for the inputand output sections of the cleaning system, gas purging can be providedduring the communication between the sections to minimizing crosscontamination between the sections. For example, a positive pressure orflow can be established from the clean environment to the dirtyenvironment during a door between the two sections is open.Alternatively, negative pressure can be established in the dirtyenvironment to also form positive pressure or flow from the cleanenvironment to the dirty environment.

FIGS. 5A-5B illustrate exemplary configurations for purging the cleaningchamber according to an embodiment of the present invention. In FIG. 5A,cleaning chamber 34 is pressurized, or purged with cleaned gas 45Abefore opening the input door to the dirty environment 32. After theinput door is opened, a positive flow 42 can be established from thecleaning chamber 34 to the dirty environment 32, thus minimizing anycross contamination resulted from a back flow from the dirtyenvironment. The pressure in the cleaning chamber 34 can be equal orgreater than the pressure in the dirty environment 32.

In FIG. 5B, cleaning chamber 34 is evacuated, or pressure regulated withcleaned gas inlet 45A and outlet 45B before opening the output door tothe cleaned environment 36. After the output door is opened, a positiveflow 43 can be established from the cleaned environment 36 to thecleaning chamber 34, thus minimizing any cross contamination resultedfrom a back flow to the cleaned environment. The pressure in thecleaning chamber 34 can be equal or lower than the pressure in thecleaned environment 36.

In some embodiments, the present invention discloses a system forcleaning a workpiece, such as a reticle carrier. The system can includea first station, wherein the first station comprises a first roboticmechanism for transferring a workpiece. The first station can be aninput section of the cleaning system, which can be configured to accepta dirty workpiece, e.g., a workpiece that is needed to be cleaned. Thesystem can include a second station, wherein the second stationcomprises a second robotic mechanism for transferring a workpiece. Thesecond station can be an output section of the clean system, which canbe configured to accept a cleaned workpiece, e.g., a workpiece that hasbeen cleaned by the cleaning system. The system can include a chamber,wherein the chamber is operable to clean a workpiece. The chamber caninclude an entrance, wherein the entrance is operable for enabling aworkpiece to be transferred from the first station to the chamber by thefirst robotic mechanism. The chamber can include an exit, wherein theexit is operable for enabling a workpiece to be transferred from thechamber to the second station by the second robotic mechanism. Thechamber can include liquid nozzles for delivering cleaning liquid,drying nozzles for delivering drying gas, and optional heaters forheating the workpiece. The second station can be isolated from the firststation. In general, the first station and the second station sandwichthe cleaning chamber, and thus are isolated from each other. In someembodiments, the first and second stations are also isolated during theoperation of the cleaning system. For example, the cleaning chamber canbe configured to isolate the first/second station when the cleaningchamber is exposed to the second/first station, respectively. A doorfacing the first station can be close when a door facing the secondstation is open, thus isolating the first and second stations. Theenvironment of the second station is cleaner than the environment of thefirst station. Since the first station houses the dirty workpiece, andthe second station houses the cleaned workpiece, maintaining the secondstation cleaner than the first station can be beneficial with regard tothe workpiece cleanliness. For example, the first station comprisesfilter laminar flow coupled to the outside ambient. The second stationcomprises filter recirculation gas flow with raised floor and chiller,which can maintain a much cleaner ambient. The system can include amechanism to establish a curtain flow at the exit of the chamber.

In some embodiments, the cleaning system can include multiple chambersfor cleaning multiple workpieces. For example, a first chamber can beused to clean a first component of the workpiece, and a second chambercan be used to clean a second component of the workpiece. The system caninclude an input load port coupled to the first station for accepting aworkpiece to be transferred to the chamber. The system can include anoutput load port coupled to the second station for accepting a workpiecefrom the chamber. For isolating the first and second stations, in someembodiments, the entrance and exit of the chamber are not open at a sametime to provide isolation of the first station from the second station.The system can include a mechanism to establish a flow from the secondstation to the chamber during the opening of the entrance or from thechamber to the first station during the opening of the exit.

During the transfer of object, e.g., from the input port (dirty) to thecleaning chamber (for cleaning) to the output port (clean), conditionscan be established to minimizing recontamination of the cleaned object.

FIGS. 6A-6B illustrate exemplary flowcharts for cleaning objects usingseparate dirty and cleaned environments according to an embodiment ofthe present invention. In FIG. 6A, operation 50 establishes twoenvironments with different cleanliness levels interfacing a cleaningchamber. Operation 51 transfers objects to be cleaned from the dirtierenvironment to the cleaning chamber to the cleaner environment, whereinthe cleaned objects are isolated from the dirtier environment to preventcross contamination.

In FIG. 6B, operation 54 brings an object to be cleaned to a dirtyenvironment. Operation 55 transfers the object from the dirtyenvironment to a cleaning chamber. Operation 56 cleans the object in thecleaning chamber. Operation 57 transfers the cleaned object from thecleaning chamber to a cleaned environment, wherein the cleanedenvironment is isolated from the dirty environment to prevent crosscontamination. Operation 58 brings the cleaned object out of the cleanedenvironment.

FIG. 7 illustrates another exemplary cleaning process using separatedirty and cleaned environments according to an embodiment of the presentinvention. In FIG. 7, operation 60 establishes a dirty environment foraccepting objects to be cleaned, and a cleaned environment for acceptingthe objects after being cleaned, wherein the two environments interfacea cleaning chamber for cleaning the objects. Operation 61 establisheslaminar flow in the dirty environment to reduce contamination. Operation62 brings an object to be cleaned to the dirty environment. Operation 63isolates the cleaning chamber and pressurizing the cleaning chamberbefore open to the dirty environment to minimize back flow from thedirty environment. Operation 64 transfers the object to be cleaned fromthe dirty environment to the cleaning chamber. Operation 65 cleans theobject in the cleaning chamber. Operation 66 establishes recirculatingflow in the cleaned environment to reduce contamination. Operation 67cools the recirculating flow in the cleaned environment and/orestablishing a flow curtain in front of the cleaning chamber to reducecontamination. Operation 68 isolates the cleaning chamber and loweringpressure in the cleaning chamber before open to the cleaned environmentto minimize back flow from the cleaning chamber. Operation 69 transfersthe cleaned object from the cleaning chamber to the cleaned environment.

In some embodiments, the present invention discloses a method forcleaning a workpiece. The method can include transferring a workpiecefrom a first station to a chamber through an entrance of the cleaningchamber. The method can include cleaning the workpiece in the cleaningchamber. The method can include transferring the workpiece from thechamber to a second station through an exit of the chamber. The secondstation is isolated from the first station. The environment of thesecond station is cleaner than the environment of the first station.

In some embodiments, the method can further include loading theworkpiece to an input load port to be transferred to the first station.The method can also include unloading the workpiece from the secondstation to an output load port. The method can also include closing theexit of the chamber before transferring the workpiece from the firststation to the chamber. The method can also include pressurizing thechamber before opening the entrance of the chamber for transferring theworkpiece from the first station to the chamber. The method can alsoinclude closing the entrance of the chamber before transferring theworkpiece from the chamber to the second station. The method can alsoinclude lowering a pressure in the chamber before opening the exit ofthe chamber for transferring the workpiece from the chamber to thesecond station. The method can also include establishing a recirculatinggas flow in the second station. The method can also include cooling theenvironment of the second station. The method can also includeestablishing a curtain flow at the exit of the chamber.

In some embodiments, the method can include establishing twoenvironments with different cleanliness levels interfacing a cleaningchamber; transferring a workpiece from the dirtier environment to thecleaning chamber for cleaning; transferring the workpiece from thecleaning chamber to the cleaner environment, wherein the twoenvironments are isolated from each other during the transfer of theworkpiece.

The above description describes a cleaning chamber between two dirty andcleaned environments. However, the present invention is not so limited,and can be equally applied to any processing chamber requiring a levelof cleanliness established by separating the input dirty with the outputcleaned environments.

Further, the cleaner system and method of cleaning a workpiece caninclude other features, such as the features described in othersections. For example, the features can include separate cleaningchambers, gripper arms for picking and placing different componentsusing a same robot handler, gripper arms for holding differentcomponents at different locations, horizontal spin cleaning and dryingfor outer container, hot water and hot air cleaning process, verticalnozzles and rasterizing megasonic nozzles for cleaning with hot airnozzles for drying, vacuum decontamination chambers for outgassingdifferent components, and purge gas loading and unloading station.

In an embodiment, the present invention discloses separate cleaningchambers for different components of an object. The separation canprevent contamination of cleaner components by dirtier components duringthe cleaning process. For example, the inner container of a doublecontainer euv reticle carrier is cleaner than the corresponding outercontainer, since it has been designed to be protected by both the outercontainer and an inert gas ambient. Thus separate cleaning chambers forthe outer container components and for the inner container componentscan minimize the contamination of the inner container, for example, bythe outer container during cleaning if the inner and outer componentsare cleaned together.

In an embodiment, the number of cleaning chambers is determined based onthe levels of cleanliness. For example, a double container carrier canhave two levels of cleanliness: a dirtier level for the outer containerand a cleaner level for the inner container. Thus two separate cleaningchambers can be used. A first cleaning chamber is used for cleaning theouter container of a double container carrier, including the upper lidand the lower support of the outer container. A second cleaning chamberis used for cleaning the inner container of a double container carrier,including the upper lid and the lower support of the inner container.

In an embodiment, the levels of cleanliness can be further refined. Forexample, four levels of cleanliness can be established, generating twocleanliness levels for each outer and inner container, since the upperlid and the lower support of a container can attract different levels ofcontamination. Thus four separate cleaning chambers can be used. Firstand second cleaning chambers are used for cleaning the upper lid and thelower support of the outer container of a double container carrier,respectively. Third and fourth cleaning chambers are used for cleaningthe upper lid and the lower support of the inner container of a doublecontainer carrier, respectively.

In an embodiment, each component of the object is cleaned separately inseparate cleaning chambers. For example, a double container carrier canbe cleaned in four separate cleaning chambers, one for upper lid ofouter container, one for lower support for outer container, one forupper lid of inner container, and one for lower support for innercontainer.

FIGS. 8A-8B illustrate exemplary separate cleaning chambers fordifferent components of an object according to an embodiment of thepresent invention. In FIG. 8A, four different cleaning chambers 83A-83Dare disposed next to each other for cleaning different components of anobject, for example, the four components 80A-80D of a double containercarrier 80. A carrier 80 is loaded to a loading station 81, and then thecomponents are picked up by the robot 82A having gripper arms 82B in atransfer station 82. The robot 82A can travel between the multiplecleaning chambers 83A-83D, for example, by a linear guide 82C.

In FIG. 8B, the cleaning chambers 83A-83D separate the input dirtyenvironment 82 from the output cleaned environment 86, thus providing anadditional level of cleanliness for the objects to be cleaned. Anobject, such as a double container carrier 80, is loaded to an inputloading station 81, and is transferred by a robot 82A to the dirtyenvironment 82. From there, the components of the carrier 80 are placedto different cleaning chambers 83A-83D, to be cleaned separately. Afterbeing cleaned, a cleaned robot 86A picks up the components, places intothe cleaned environment 86, and to the output unloading station 87.

FIG. 9 illustrates an exemplary cleaner system using separate cleaningchambers for different components of an object according to anembodiment of the present invention. An object, such as a doublecontainer carrier 80, is loaded to an input loading station 91, and istransferred by a robot to the dirty environment 92. From there, thecomponents of the carrier 80 are placed to different cleaning chambers93, to be cleaned separately. After being cleaned, a cleaned robot picksup the components to bring to the cleaned environment 96. Optionaloutgassing chambers 95A-95B can be included to outgas the componentsbefore assembling the components in an assembling station 98. Afterbeing assembled, the assembled carrier is outputted to the outputunloading station 97.

In an embodiment, the present invention discloses separate outgassingchambers 95A and 95B for decontaminating the components after beingcleaned. Four outgassing chambers can be used. Preferably, twooutgassing chambers are used, one for inner container components and onefor outer container components. For outgassing decontamination, thelevels of cleanliness can be accomplished by using two outgassingchambers, in combination with four cleaning chambers for different partsof the inner and outer containers. Details for the outgassing chamberwill be described in later sections.

In an embodiment, the present invention discloses an assembling station98 for assembling the components together after being cleaned andoutgassing decontaminated separately. The assembling station preferablycomprises a clean environment, as clean as the cleaned environment 96,or even cleaner. For example, the assembling station can be filled withnitrogen, to ensure that the volume inside the carrier is filled withnitrogen, thus preventing any oxygen for potential oxidation orbacterial growth. Details for the assembling station will be describedin later sections.

In some embodiments, the present invention discloses a system forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The first component can be an outer box, made of a polymermaterial, and including a lid and a body portions. The second componentcan be an inner box, made of a metallic material, and including a lidand a body portions. The system can include a first chamber, wherein thefirst chamber is operable to clean the first component, a secondchamber, wherein the second chamber is operable to clean the secondcomponent, a first station, wherein the first station is coupled to thefirst and second chambers, wherein the first station comprises a firstrobotic mechanism, wherein the first robotic mechanism is operable totransfer the first component from the first station to the first chamberand to transfer the second component from the first station to thesecond chamber.

In some embodiments, the first component comprises a lid and a body, andwherein the first chamber is operable to clean both the lid and thebody. The first component can include a lid and a body, and wherein thefirst chamber can include a first lid chamber operable to clean the lidand a first body chamber operable to clean the body. The secondcomponent can include a lid and a body, and wherein the second chamberis operable to clean both the lid and the body. The second component caninclude a lid and a body, and wherein the second chamber can include asecond lid chamber operable to clean the lid and a second body chamberoperable to clean the body. The first chamber can include a firstentrance and a first exit, wherein the second chamber can include asecond entrance and a second exit, wherein the first station is coupledto the first and second entrances, wherein the system further caninclude a second station, wherein the second station is coupled to thefirst and second exits, wherein the second station can include a secondrobotic mechanism, wherein the second robotic mechanism is operable totransfer the first component from the first chamber to the secondstation and to transfer the second component from the second chamber tothe second station. The first station can be isolated from the secondstation. The system can further include a load port coupled to the firststation for accepting a workpiece; one or more third chambers, whereinthe third chambers are operable to enable outgassing the first andsecond components after cleaning; and a fourth chamber, wherein thefourth chamber is operable to enable assembling of the first and secondcomponents after cleaning.

FIGS. 10A-10B illustrate exemplary flowcharts for cleaning objects usingseparate cleaning chambers according to an embodiment of the presentinvention. In FIG. 10A, operation 100 receives an object to be cleanedcomprising a plurality of components, such as a double containercarrier. Operation 101 disassembles the object into individualcomponents. For example, a double container carrier can be disassembledinto an outer container and an inner container. Alternatively, thedouble container carrier can be disassembled into a lid and a support ofthe outer container and into a lid and a support of the inner container.Operation 102 transfers individual components into separate cleaningchambers for cleaning Operation 103 assembles the cleaned individualcomponents, preferably in cleaned ambient to preserve the cleanliness.The assembling station is thus preferably integrated with the multiplecleaning chambers to maintain the cleanliness level.

In FIG. 10B, separate environments are implemented together withseparate cleaning chambers. Operation 104 brings an object comprising aplurality of components to a dirty environment. Operation 105disassembles and transferring individual components from the dirtyenvironment to individually cleaning chambers to be cleaned separatelyto prevent cross contamination. Operation 106 transfers the cleanedcomponents from the cleaning chambers to a cleaned environment, whereinthe cleaned environment is isolated from the dirty environment toprevent cross contamination. Operation 107 conditions the cleanedcomponents. For example, the cleaned components can undergo vacuumdecontamination, to remove trapped gas within the components. Operation108 assembles the cleaned individual components.

FIG. 11 illustrates an exemplary flowchart for separately cleaningobjects using separate cleaning chambers according to an embodiment ofthe present invention. Operation 110 establishes a dirty environment anda cleaned environment, wherein the two environments interface aplurality of cleaning chambers. Operation 111 brings a double-containercarrier to the dirty environment, wherein the double-container carriercomprises a top and bottom inner container and a top and bottom outercontainer. Operation 112 disassembles the double-container carrier intoindividual components. Operation 113 transfers individual componentsinto separate cleaning chambers for cleaning. Operation 114 cleans theindividual components in the individual cleaning chambers. Operation 115transfers the individual components from the cleaning chambers to acleaned environment. Operation 116 outgases the individual components ina plurality of separate outgassing chambers. Operation 117 assembles thecleaned individual components to form the double-container carrier whilefilling the inside of the outer container with inactive gas.

In some embodiments, the present invention discloses a method forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The method can include transferring the first component of aworkpiece from a first station to a first chamber; transferring thesecond component of the workpiece from the first station to a secondchamber; cleaning the first and second components in the first andsecond chambers.

In some embodiments, the method can further include transferring thefirst component from the first chamber to a second station through thefirst exit; transferring the second component from the second chamber toa second station through the second exit; transferring the first andsecond components outgassing the first and second components aftercleaning; and transferring the first and second components to a fourthchamber, wherein the fourth chamber is operable to assemble the firstand second components.

Further, the cleaner system and method of cleaning a workpiece caninclude other features, such as the features described in othersections. For example, the features can include separate environments,gripper arms for picking and placing different components using a samerobot handler, gripper arms for holding different components atdifferent locations, horizontal spin cleaning and drying for outercontainer, hot water and hot air cleaning process, vertical nozzles andrasterizing megasonic nozzles for cleaning with hot air nozzles fordrying, vacuum decontamination chambers for outgassing differentcomponents, and purge gas loading and unloading station.

In an embodiment, the present invention discloses a robot arm to handlethe object to be cleaned. A single robot handler can be used to handleall components of the object. Alternatively, multiple robot handlers canbe used. In an embodiment, a gripper handler with adjustable gripperarms is used to handle all different sizes of the components of thedouble container carrier. For example, since the outer container islarger than the inner container, the gripper arm can be enlarged tohandle the outer container and reduced to handle the inner container.Thus a single robot handler having gripper arms can be used to handleall different components of an object.

In an embodiment, the robot handler is further designed to avoid crosscontamination between the components of the object by contactingdifferent components having different cleanliness levels with differentparts of the robot handler. For example, the gripper arms grip differentcomponents at different locations of the gripper arms. A top portion ofthe gripper arms can be used to support the outer container portion. Amiddle portion of the gripper arms can be used to support the innercontainer portion.

In an embodiment, the robot handler is further designed to minimizeparticle generation. For example, the gripper arms are controlled togrip the components with minimum force to minimize friction which cangenerate particles. Instead of using pneumatic control, motor control,with or without feedback sensor, can be used to control the forcesgenerated by the gripper arms when holding the carrier components.

FIGS. 12A-12B illustrate an exemplary robot gripper according to anembodiment of the present invention. The robot gripper comprises twogripper arms 121A and 121B coupled to a handler 120. A movementmechanism 126, such as a motor, can move 127 the gripper arms, forenlarging or narrowing the grip of the gripper arms to accommodatedifferent sizes of objects. The motor can have a controller component,such as a current sensor (built in the motor, not shown) or pressuresensors 125A/125B to control the forces from the gripper arms on theobject to be gripped. Optional inserts 122A/122B can be included forfurther reducing the particle generation due to friction.

FIGS. 13A-13C illustrate exemplary gripping configurations of thegripper arms according to an embodiment of the present invention. InFIG. 13A, the gripper arms 121 support a component 130 of an innercontainer (an upper lid, for example) from the middle portion 131 of thegripper arm inserts 122. Pins 135 can be used to lock the component 130,by mating with a recess 137 of the component 130 (see FIG. 13C). In FIG.13B, the gripper arms 121 support a component 132 of an outer container(an upper lid, for example) from the top portion 133 of the gripper arminserts 122. Pins 135 can be used to lock the component 133, by matingwith a recess of the component (not shown, but similar to FIG. 13C). Thegripper arms thus grip different components of the objects at differentlocations (middle portion 131 and top portion 133), thus can minimizecross contamination between different components having different levelsof cleanliness. Other configurations can be used, such as gripper armsupporting a component from the bottom of the insert, or the gripper armsupporting a component directly by the gripper arm without the insert.

In some embodiments, the present invention discloses a robot handler forholding a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The robot handler can include a handle, wherein the handlecomprises two arms, wherein the distance between the two arms isadjustable to support the first and the second components; a mechanismcoupled to the two arms to adjust the distance between the two arms;wherein each arm comprises a first portion for gripping the firstcomponent and a second portion for gripping the second component,wherein the first portion and the second portion are disposed ondifferent locations on the arm.

In some embodiments, the mechanism can include a motor. The firstportion can include a middle portion of the arm. The second portion caninclude a top or bottom portion of the arm. The robot handler canfurther include a feedback sensor for controlling the force acting onthe first or second components. The robot handler can include an insertcoupled to the arm, wherein the first portion comprises a middle portionof the insert. The robot handler can include an insert coupled to thearm, wherein the second portion comprises a top or bottom portion of theinsert. The robot handler can include a pin for mating with a recess onthe first or second component.

FIGS. 14A-14B illustrate exemplary flowcharts for gripping objects usingthe present gripper arms according to an embodiment of the presentinvention. In FIG. 14A, operation 140 opens gripper arms to encompass awork object. Operation 141 closes the gripper arms to hold the workobject. Operation 142 optionally senses the force on the gripper arms.Operation 143 controls the forces of the gripper arms to minimizeparticle generation due to contact.

In FIG. 14B, operation 144 provides an object comprising a plurality ofseparatable components. Operation 145 opens gripper arms to encompass acomponent of the object. Operation 146 moves the gripper arms to contactthe object component at a desired location of the gripper arms, whereinthe locations of the gripper arms are selected to minimize crosscontamination between components of the object. Operation 147 closes thegripper arms to hold the object component.

FIG. 15 illustrates an exemplary flowchart for separately cleaningobjects using separate cleaning chambers according to an embodiment ofthe present invention. Operation 150 moves the gripper arms to contactthe top portion of the outer container at a first location of thegripper arms. Operation 151 transfers the top portion of the outercontainer to a first process chamber. Operation 152 moves the gripperarms to contact the top portion of the inner container at a secondlocation of the gripper arms. Operation 153 transfers the top portion ofthe inner container to a second process chamber. Operation 154 moves thegripper arms to contact the bottom portion of the inner container at thesecond location of the gripper arms. Operation 155 transfers the bottomportion of the inner container to a third process chamber. Operation 156moving the gripper arms to contact the bottom portion of the outercontainer at a first location of the gripper arms. Operation 157transfers the bottom portion of the outer container to a fourth processchamber.

In some embodiments, the present invention discloses a method fortransferring a workpiece, wherein the workpiece comprises a firstcomponent and a second component, wherein the first component surroundsthe second component. The method can include enlarging a first distancebetween two gripper arms to encompass the first component; gripping thefirst component at a first portion on the gripper arms; transferring thefirst component to a first destination; enlarging a second distancebetween two gripper arms to encompass the second component; gripping thesecond component at a second portion on the gripper arms; transferringthe second component to a second destination, wherein the first portionand the second portion are disposed on different locations on the arm.

In some embodiments, the enlarging and gripping can be performed by amotor. The method can further include mating a pin on the arm with arecess on the first or second component.

In some embodiments, the robot handler can be used in transferring aworkpiece that has a first component surrounding a second component. Therobot handler can be used in other configurations described in thepresent description.

In an embodiment, the present invention discloses different cleaningchambers for cleaning different components of an object. To clean theobject, a plurality of liquid nozzles can be directed toward the objectsurfaces. The liquid nozzles can deliver mixtures of cleaning liquid,rinsing liquid (such as DI water), and other chemical liquid designedfor cleaning and decontaminating the object, such as surfactant or metalremoval agent. Ultrasonic or megasonic nozzles can deliver energeticliquid to improve the cleaning power. The amount of liquid can becarefully controlled, such as spraying with fine droplets and aerosolgas bubbles together with carrier gas (such as nitrogen, air or inertgas). The liquid nozzles can also be configured to deliver gas, such asnitrogen or filtered air, or gas/liquid mixtures. Fast evaporatingliquid can be used, such as alcohol with low boiling temperature andhigh vapor pressure. Hot carrier gas and hot liquid can also beutilized, for example, to assist in fast drying by evaporation. Inaddition, the chamber and the positioning of the object can be designedso that the liquid can be removed by good drainage with no liquidretention and no liquid dead spots. Further, the liquid vapor can beremoved by fast exhaust and low chamber pressure, for example, bypurging with dry gas and/or by maintaining a vacuum pressure inside thecleaning chamber during the liquid cleaning cycle.

The nozzles can be designed to overlap the surface, providing a completecoverage of the surface to ensure complete cleaning. The nozzles canprovide a small angle flow, for example, to have adequate cleaningforce. The angle of impact can be perpendicular to the surface forgreater force, or can be along the surface for higher surface coverage.In an aspect, the object to be cleaned is a semiconductor container,thus contamination tends to be small particulates or metalcontamination, and the present invention discloses cleaning nozzleshaving medium pressure and low angle of impact of cleaning for highercoverage area.

In a typical cleaning process, cleaning liquid, such as cleaningsolution, is sprayed onto the object, such as the reticle carriercomponents. Additives, such as surfactant, detergent, orcontamination/metal removal agents may be added into the water or otherliquid, for example, by aspiration or pumping. The contamination/metalremoval agent can be a metal removal agent such as a chelating agent. Ahigh alkaline detergent may be used in place of the surfactant. UV lightcan be added, for example, to aid removal of contamination. Aftercompleting cleaning and/or contamination removal, the object is thenrinsed by spraying with a rinsing liquid, such as DI water. Cycliccleaning/rinsing processes can be performed for effective cleaning. Thecleaning liquid can be collected for recycling.

In an embodiment, the cleaning process provides small liquid droplets toaid in the subsequent drying process. In addition, purged gas or liquidspray can be provided to break droplets into even smaller ones. In theareas where the liquid is consolidated, for example, at the bottom ofthe surfaces, gas or liquid spray can be provided to break the large,consolidated liquid into small droplets, such as blowing the liquidaway.

In an embodiment, the liquid can be heated to increase the volatility,adding in the ease of liquid residue removal. In addition, the objectand the process chamber can also be heated, for example, by IR or UVlamps.

In the cleaning chamber, the object can be positioned so that the liquidcan run down by gravity. After liquid cleaning, the object can be driedby gas flow, for example, gas nozzles providing nitrogen, filtered air,liquid or aerated liquid, can be directed toward the object to helpremove liquid residue trapped by surface tension. For example, a bottomgas nozzle can be directed toward the bottom of the object, in additionto a top gas nozzle can be directed toward the top surface, and othergas nozzles directed toward irregular shapes of the object where liquidresidue can be trapped. Additionally, spin drying can be used.

In some embodiments, the present invention discloses a system forcleaning a workpiece. The system can include a chamber; one or morefirst nozzles, wherein the first nozzles are operable to deliver acleaning liquid; one or more second nozzles, wherein the second nozzlesare operable to deliver a megasonic liquid; one or more third nozzles,wherein the third nozzles are operable to deliver a drying gas; a firstmechanism for moving the second nozzles in a first direction; a secondmechanism for moving the workpiece in a second direction, wherein thesecond direction is different from the first direction.

In some embodiments, the first direction can be horizontal and thesecond direction can be vertical. The second nozzles can move cyclicallyfrom one side of the workpiece to an opposite side of the workpiece. Theworkpiece can move vertically. The third nozzles can be disposed abovethe first nozzles. The second nozzles can be disposed interspersed withthe first nozzles.

FIGS. 16A-16C illustrate exemplary cleaning sequence of an objectaccording to an embodiment of the present invention. In FIG. 16A, anobject, such as an upper lid of an outer container of a double containercarrier, is brought from a dirty environment 162 under laminar flow 161to a cleaning chamber 164. The cleaning chamber is isolated from acleaned environment 166, for example, by closing access door to thecleaned environment. In addition, purge gas 163 can be provided to thecleaning chamber 164 to prevent contamination back flow from the dirtyenvironment to the cleaning chamber.

In FIG. 16B, the cleaning chamber is isolated, and liquid and gasnozzles 165 can provide liquid and gas to clean the object. The objectcan be disposed in a horizontal direction, and spin cleaning and drying167 can be applied to improve the cleaning and drying processes. Thenozzles 165 can operate in sequence, for example, delivering liquid forcleaning and subsequently delivering gas for drying. Hot liquid and hotgas can be used. Heaters can be provided to provide thermal energy,assisting in the cleaning and drying process.

In FIG. 16C, the outlet door is open and the object is brought to thecleaned environment 166. Low pressure can be established in the cleaningchamber, for example, through exhaust 169, to prevent any contaminationback flow to the cleaned environment. Curtain gas 168 can be used tofurther minimize the contamination back flow.

FIGS. 17A-17B illustrate exemplary flowcharts for cleaning objectsaccording to an embodiment of the present invention. In FIG. 17A,operation 170 rotates object to be cleaned. Operation 171 cleans theobject with hot liquid spraying. Operation 172 dries the object with hotgas. Operation 173 equalizes pressure in a cleaning chamber with aninput environment to prevent cross contamination. In FIG. 17B, operation174 transfers a component of the outer container of a double-containercarrier from the input environment to the cleaning chamber. Operation175 rotatingly cleans the component with hot liquid spraying and hot gasdrying. Operation 176 equalizes pressure in the cleaning chamber with anoutput environment to prevent cross contamination. Operation 177transfers the cleaned component from the cleaning chamber to the outputenvironment.

In an embodiment, the present invention discloses a novel cleaningchamber and process to clean components that require high level ofcleanliness, such as the inner container of a double container carrier.The cleaning chamber employs rasterizing ultrasonic or megasonic liquidspray to clean the object. In an embodiment, the ultrasonic or megasonicnozzles travel in a horizontal direction while the object travels in avertical direction, thus covering all surface areas of the object withthe spray from the ultrasonic or megasonic nozzles. In addition, liquidspray can be used for preclean, and drying nozzles can be used fordrying.

FIGS. 18A-18C and 19A-19B illustrate an exemplary cleaning chamberemploying ultrasonic or megasonic liquid spray according to anembodiment of the present invention. An object is brought in to acleaning chamber 184, preferably in a vertical direction and from a topportion of the cleaning chamber. The object is then brought to a bottomportion, and then slowly raised back 183 to the top portion, as shown inthe sequence in FIGS. 18A-18C and 19A-19B. At the bottom portion, liquidnozzles 181 deliver liquid to the object 180 for cleaning Liquid nozzles181 are preferably disposed a distance from the object, thus spraying atthe object surface through a large area 181A. Ultrasonic or megasonicnozzles 182 clean the top portion of the object, and with the objectslowly raised up, nozzles 182 continuously clean the whole objectsurface. In addition, the ultrasonic or megasonic nozzles move in ahorizontal direction 191, thus can clean the object in a horizontaldirection. The ultrasonic or megasonic nozzles are preferably disposedclose to the object for effective cleaning, thus spraying at the objectsurface through a small area 182A. With the rasterizing action,including horizontal movement 191 of the ultrasonic or megasonicnozzles, and the vertical movement 193 of the object, the ultrasonic ormegasonic spray can cover the whole surface of the object, providing aneffective cleaning process.

Above the ultrasonic or megasonic nozzles are a number of drying nozzles183, pointing down at the object for drying the object and for blowingdown the liquid. The drying nozzles 183 can be disposed to deliver adownward area 183A. Hot liquid and hot gas, together with heaters can beused. The combination of liquid spray, ultrasonic or megasonic liquidspray, and drying spray can clean the object with high level ofcleanliness.

FIGS. 20A-20B illustrate exemplary flowcharts for cleaning objectsaccording to an embodiment of the present invention. In FIG. 20A,operation 200 cleans an object with hot liquid spraying. Operation 201rasterizingly cleans the object with megasonic spraying. Operation 202dries the object with hot gas. In FIG. 20B, operation 203 equalizespressure in a cleaning chamber with an input environment to preventcross contamination before transferring a component of the innercontainer of a double-container carrier from the input environment tothe cleaning chamber. Operation 204 linearly moves the component in afirst direction. Operation 205 sprays the component with hot liquid.Operation 206 sprays the component with megasonic liquid havingmovements in a second direction. Operation 207 dries the component withhot gas. Operation 208 equalizes pressure in the cleaning chamber withan output environment to prevent cross contamination before transferringthe cleaned component from the cleaning chamber to the outputenvironment.

In some embodiments, a method for cleaning a workpiece can includeproviding a workpiece in a cleaning chamber; moving the workpiece in afirst direction; spraying the workpiece with a cleaning liquid; sprayingthe workpiece with a megasonic liquid, wherein the megasonic liquidcomprises movement in a second direction, wherein the second directionis different from the first direction; spraying the workpiece with adrying gas. The megasonic nozzles can move cyclically from one side ofthe workpiece to an opposite side of the workpiece. The drying gas canbe spraying above the cleaning liquid and the megasonic liquid. Thecleaning liquid can be spraying interspersed with the megasonic liquid.The method can further include equalizing the pressure in the cleaningchamber before transferring the workpiece to the cleaning chamber,and/or equalizing the pressure in the cleaning chamber beforetransferring the workpiece out of the cleaning chamber.

In an embodiment, the present invention discloses a decontaminationchamber to decontaminate the components after cleaning. Thedecontamination can employ a vacuum chamber, with high vacuum preferred,for example, less than 10⁻³ Torr, or preferably less than 10⁻⁶ Torr. Thevacuum chamber can accelerate the outgassing of the components, removingany trapped gas within the components.

The vacuum chamber can be designed to provide configurations witheffective pumping and high pumping conductance. The vacuum chamber canfurther comprise a heating mechanism, such as IR heaters or chamber wallheaters. The heaters can be heated to between 40 and 90C, and preferablyat about 70C. The heating temperature depends on the materials, forexample, low temperature of less than 100C is preferred for polymermaterials, and high temperature of above 100C can be used for metal.

In an embodiment, outgassing monitoring sensors, such as residue gasanalysis (RGA), can be provided to measure the release of contaminantswithin the vacuum chamber, which then can be used to monitor thedecontamination process.

In an embodiment, inert purge gas is provided inside vacuum chamber,such as nitrogen gas, to back fill any gap left by the outgassingcontaminants. Cyclic pressuring and vacuuming can be performed,outgassing the contaminants and then back filling with inert gas.

In an embodiment, after decontaminate the components with high vacuum,the chamber is pressurized with nitrogen before opening, effectivelycoating the surfaces (and filling the sub-surfaces) of the componentswith nitrogen molecules, further improving the cleanliness andpreventing adhering particulates.

FIG. 21A illustrates an exemplary decontamination chambers according toan embodiment of the present invention. Vacuum chamber 210 comprises avacuum line 213 connected to a vacuum pump 219, such as a turbo pump ora cryo pump, creating a high vacuum within the chamber 210. A shut offvalve 217A can be provided to isolate the vacuum pump line. Heater 212is disposed in the vacuum chamber for heating the chamber and thecomponents 211A and 211B. Sensors 215, such as a RGA for monitoring theoutgassing species, can be included. A shut off valve 217B can beprovided to isolate the gas monitor, e.g., sensor 215. Purge gas 214 canprovide an inert ambient to the vacuum chamber, for example, to preventback flowing of contamination before transferring the components to theoutside. A direct connection of the gas monitor 215 to thedecontamination chamber can be used if the components does notoutgassing too much. For example, for the inner box, which is made of ametallic material, the outgassing contaminant can be much less thanpolymer materials.

FIG. 21B illustrates another exemplary decontamination chambersaccording to an embodiment of the present invention. Vacuum chamber 210comprises a vacuum line 213 connected to a vacuum pump 219, such as aturbo pump or a cryo pump, creating a high vacuum within the chamber210. A shut off valve 217A can be provided to isolate the vacuum pumpline. Heater 212 is disposed in the vacuum chamber for heating thechamber and the components 211A and 211B. Sensors 215, such as a RGA formonitoring the outgassing species, can be included. A shut off valve217B can be provided to isolate the gas monitor, e.g., sensor 215. Purgegas 214 can provide an inert ambient to the vacuum chamber, for example,to prevent back flowing of contamination before transferring thecomponents to the outside. Another vacuum pump 219A can be connectedbetween the valve 217B and the gas monitor 215, to maintain a vacuumlevel for the gas monitor. A differential valve 218 can be includedbetween the gas monitor and the chamber. The differential valve caninclude a small hole (as compared to the diameter of the conduit, sothat the conductivity of the differential valve is much less than theconductivity of the conduit), in order to restrict a flow from thechamber to the gas monitor. Thus the contaminants released from thecomponents can be restricted from reaching the gas monitor. Adifferential valve connection of the gas monitor 215 to thedecontamination chamber can be used if the components can be outgassingtoo much. For example, for the outer box, which is made of a polymermaterial, the outgassing contaminant can be high, and can saturate thegas monitor if not restricted from reaching the gas monitor.

In some embodiments, a system for cleaning a workpiece can include afirst chamber, wherein the first chamber is operable to clean aworkpiece, a second chamber, wherein the second chamber comprises avacuum ambient to outgassing the workpiece after being cleaned; arobotic mechanism for transferring the workpiece between the firstchamber and the second chamber.

The system can further include a first vacuum pump coupled to the secondchamber; a first shut off valve connected between the first vacuum pumpand the second chamber; a gas monitor coupled to the second chamber; asecond shut off valve connected between the gas monitor and the secondchamber; a differential valve connected between the gas monitor and thesecond chamber; a second vacuum pump connected between the differentialvalve and the second chamber; a heater for heating the workpiece in thesecond chamber; a nozzle for injecting an inactive gas to the secondchamber.

In some embodiments, the present invention discloses a system forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The system can include a first chamber, wherein the firstchamber is operable for outgassing the first component of the workpiece;a first vacuum pump coupled to the first chamber through a first shutoff valve; a first gas monitor coupled to the second chamber through anassembly, wherein the assembly comprises a second shut off valve and adifferential valve; a second vacuum pump fluidly connected between thefirst gas monitor and the assembly, wherein the second monitor isoperable to maintain a vacuum ambient at the gas monitor; a secondchamber, wherein the second chamber is operable for outgassing thesecond component of the workpiece; a third vacuum pump coupled to thesecond chamber through a third shut off valve; a second gas monitorcoupled to the second chamber through a fourth shut off valve.

The system can further include a third chamber for cleaning the firstcomponent before transferring to the first chamber, and a fourth chamberfor cleaning the second component before transferring to the secondchamber; and a heater for heating the workpiece in the first or secondchamber, and a nozzle for injecting an inactive gas to the first orsecond chamber.

FIGS. 22A-22B illustrate exemplary flowcharts for decontaminatingobjects according to an embodiment of the present invention. In FIG.22A, operation 220 cleans an object. Operation 221 outgases the cleanedobject. Operation 222 optionally injects inactive purge gas. Operation223 optionally heats the object. Operation 224 optionally monitors theoutgassed species. Operation 225 pressurizes chamber before transferringobject out.

In an embodiment, the present invention further discloses a process fordecontaminating an object by separating the components of the object foroutgassing. In FIG. 22B, operation 226 cleans separately the componentsof a double-container carrier. Operation 227 groups similar componentsfor outgassing process. Operation 228 assembles the double-containercarrier.

In some embodiments, the present invention discloses a method forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The method can include transferring the first component of aworkpiece to a first chamber; pumping the ambient within the firstchamber; coupling the first chamber to a first gas monitor through adifferential valve; transferring the second component of a workpiece toa second chamber; pumping the ambient within the second chamber;coupling the second chamber directly to a second gas monitor.

The method can further include coupling the first chamber directly to afirst gas monitor after a signal from the first gas monitor is stable;stopping the pumping after a level of gaseous contaminants in the firstor second chamber reaches a desired level; cleaning the first componentbefore transferring to the first chamber; cleaning the second componentbefore transferring to the second chamber; injecting an inactive gas tothe first or second chamber during the pumping; heating the first orsecond component in the first or second chamber during the pumping; andpressurizing the first or second chamber before transferring the firstor second component out of the first or second chamber.

In an embodiment, the present invention discloses an assembling station,preferably an integrated assembly station to assemble theseparately-cleaned components under a control environment. For highlevel cleanliness, avoiding exposure to potential sources ofcontamination should be considered. Thus, after being cleanedseparately, the components are assembled in a cleaned environment tomaintain the level of cleanliness, for example, to minimize anycontamination of the inner container by exposing to outside ambient.

In an embodiment, the assembling station is filled with nitrogen. Thusafter transferring from a vacuum decontamination chamber, which wasfilled with nitrogen before open to the transfer process, the componentsare transferred to the assembly station, which is filled with nitrogen.The assembling station therefore can preserve the cleanliness of thecomponents after cleaning.

In an embodiment, the present invention discloses an assembling stationfor assembling double container reticle carrier. The assembling stationcan provide an assembling process in a clean environment (preferably anitrogen environment) with nitrogen purge between inner and outercontainers.

FIGS. 23A-23B illustrate exemplary assembling station and processesaccording to an embodiment of the present invention. The components231A/231B and 232A/232B to be assembled are transferred to theassembling station 230, which comprises nitrogen purge gas inlet 234. Abottom support 231B is placed on nitrogen nozzles. Bottom support 232Band top lid 232A are then placed on the bottom support 231B. Top lid231A is then brought in the assembling station. With the nitrogennozzles 235 providing nitrogen to the bottom support 231B, the top lid231A is assembled with the bottom support 231B, effectively purging andproviding nitrogen to the volume inside the outer container form by thebottom support 231B and the top lid 231A. With the assembling stationunder nitrogen ambient, an in some case, preferably slightlypressurized, the assembling station is open and the assembled carrier isthen transferred to the outside.

In some embodiments, the present invention discloses a system forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The system can include a first chamber, wherein the firstchamber is operable for cleaning the first component of the workpiece; asecond chamber, wherein the second chamber is operable for cleaning thesecond component of the workpiece; a third chamber, wherein the thirdchamber is operable for assembling the first and second components afterbeing cleaned; a first gas supply coupled to the third chamber, whereinthe first gas supply is operable to deliver an inactive gas to the thirdchamber; a second gas supply coupled to the third chamber, wherein thesecond gas supply is operable to deliver an inactive gas to an inside ofthe first or second component. The second gas supply can protrude towithin the third chamber to couple with an opening of the firstcomponent.

FIGS. 24A-24B illustrate exemplary flowcharts for assembling objectsaccording to an embodiment of the present invention. In FIG. 24A,operation 240 brings components of an object to an assembling chamber.Operation 241 pressurizes the assembling chamber with inactive gas.Operation 242 assembles the components together while flowing inactivegas to the inside of assembled object.

In FIG. 24B, operation 243 flows inactive gas in an assembling chamber.Operation 244 transfers a bottom component of an outer container of adouble-container carrier to the assembling chamber and coupling thebottom component with a nozzle of inactive gas. Operation 245 transfersa top and a bottom components of an inner container to the assemblingchamber, coupling to the bottom component of the outer container.Operation 246 transfers a top component of the outer container of adouble-container carrier to the assembling chamber. Operation 247 flowsinactive gas to the nozzle. Operation 248 assembles the top component ofthe outer container to the bottom component of the outer container withinactive gas filling the inside of the assembled outer container.

In some embodiments, the present invention discloses a method forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The method can include cleaning the first component; cleaningthe second component; transferring the first component to a chamber;transferring the second component to the chamber; pressurizing thechamber with an inactive gas; assembling the first and second componentsto form an assembled workpiece. The first component is disposed on aconduit coupled to a gas supply outside the chamber. The method canfurther include flowing inactive gas to the conduit.

In an embodiment, the present invention discloses loading and unloadingstation for a cleaner system with nitrogen purge to the volume insidethe objects. To maintain a level of cleanliness for the object inside acarrier, the inside volume is constantly purged with inert gas such asnitrogen. Thus the present invention discloses an inert gas purge for atransfer and/or storage station, ensuring a constant purge of the insidevolume.

FIG. 25 illustrates an exemplary transfer and/or storage station havingpurge nozzles according to an embodiment of the present invention. Thedouble container carrier 250 is placed on nitrogen purge nozzles 254 inthe station 252. With the nitrogen nozzles 234 providing nitrogen 255 tothe bottom support of the double container carrier 250, the volumeinside the outer container is constantly purged with refreshed nitrogen.

In some embodiments, the present invention discloses a system forcleaning a workpiece, wherein the workpiece comprises a first componentand a second component, wherein the first component surrounds the secondcomponent. The system can include a first chamber, wherein the firstchamber is operable for cleaning the first component of the workpiece; asecond chamber, wherein the second chamber is operable for cleaning thesecond component of the workpiece; a third chamber, wherein the thirdchamber is operable for support an assembled workpiece; a gas supplycoupled to the third chamber, wherein the gas supply is operable todeliver an inactive gas to an inside of the assembled workpiece. The gassupply can protrude to within the third chamber to couple with anopening of the first component.

In some embodiments, a method for cleaning a workpiece can includecleaning the first component; cleaning the second component; assemblingthe first and second components to form an assembled workpiece; flowinginactive gas to an inside of the assembled workpiece. The firstcomponent can be disposed on a conduit coupled to a gas supply outsidethe chamber.

In some embodiments, the present invention discloses a cleaner systemfor EUV carrier, including separate environments for input (for carriersto be cleaned) and output (for cleaned carriers), flow dynamics for theseparate environments, separate cleaning chambers for different parts ofthe carriers, robot handlers for minimizing cross contamination betweenthe different parts of the carriers, degassing and decontaminationchamber for removing outgassing molecules, and purging stations forproviding purge gas to the interior of the carriers.

Different configurations of the cleaner system can be used, includingsingle throughput cleaner system, double throughput cleaner system,hybrid cleaner system, and less clean cleaner system.

FIGS. 26A-26B illustrate examples of a cleaner according to someembodiments of the present invention. FIG. 26A shows a standard cleanersystem, including an input environment 262, e.g., dirty or non-cleanenvironment for the carriers to be cleaned, multiple cleaning chambers264A-264C, and an output environment 266, e.g., clean environment forthe cleaned carriers, together with an outgassing chamber 268 forremoving outgasable molecules.

FIG. 26B shows a cleaner system having double the throughput, sharing asame input environment 261, two cleaning sections 263A-263C and265A-265C, and two output environments 267 and 269, together with twooutgassing chamber 268. Carriers to be cleaned can be brought to theinput environment 261, transferred to either of the cleaning chambersections, and outputting to the output environments 267 or 269 afterbeing outgassed.

FIG. 27 illustrates an example of a hybrid cleaner system according tosome embodiments of the present invention. The hybrid cleaner system caninclude cleaning chambers 271A-271C positioned between output cleanenvironment 276 and input non-clean environment 272, together withcleaning chamber 273 sharing a same input and output environment 272.Thus a conventional reticle box, such as a reticle SMIF pod can bebrought to the input environment 272, cleaned in cleaning chamber 273,and outputted to the same input environment 272. A euv carrier can bebrought to the input environment 272, cleaned in separate cleaningchambers 274A-274C, and outputted to the output environment 276 afterbeing outgassed in outgassed chamber 278.

FIG. 28 illustrates an example of a cleaner system according to someembodiments of the present invention. The cleaner system can utilize asame input and output environment 281, with separate cleaning chambers284A-284C. A euv carrier can be brought to the input environment 281,cleaned in separate cleaning chambers 284A-284C, and then outputted tothe same environment 281 to be outgassed in outgassed chamber 288.Considerations can be applied to avoid contamination in the shareenvironment 281, such as locating the input and output in separateportions of the environment 281, and to provide laminar flow from theoutput portion to the input portion.

1. A robot handler for holding a workpiece, wherein the workpiececomprises a first component and a second component, wherein the firstcomponent surrounds the second component, the robot handler comprising ahandle, wherein the handle comprises two arms, wherein the distancebetween the two arms is adjustable to support the first and the secondcomponents; a mechanism coupled to the two arms to adjust the distancebetween the two arms; wherein each arm comprises a first portion forgripping the first component and a second portion for gripping thesecond component, wherein the first portion and the second portion aredisposed on different locations on the arm.
 2. A system as in claim 1wherein the mechanism comprises a motor.
 3. A system as in claim 1further comprising a feedback sensor for controlling the force acting onthe first or second components.
 4. A system as in claim 1 wherein thefirst portion comprises a middle portion of the arm.
 5. A system as inclaim 1 wherein the second portion comprises a top or bottom portion ofthe arm.
 6. A system as in claim 1 further comprising an insert coupledto the arm, wherein the first portion comprises a middle portion of theinsert.
 7. A system as in claim 1 further comprising an insert coupledto the arm, wherein the second portion comprises a top or bottom portionof the insert.
 8. A system as in claim 1 further comprising a pin formating with a recess on the first or second component.
 9. A method fortransferring a workpiece, wherein the workpiece comprises a firstcomponent and a second component, wherein the first component surroundsthe second component, the method comprising enlarging a first distancebetween two gripper arms to encompass the first component; gripping thefirst component at a first portion on the gripper arms; transferring thefirst component to a first destination; enlarging a second distancebetween two gripper arms to encompass the second component; gripping thesecond component at a second portion on the gripper arms; transferringthe second component to a second destination, wherein the first portionand the second portion are disposed on different locations on the arm.10. A method as in claim 9 wherein the enlarging and gripping areperformed by a motor.
 11. A method as in claim 9 wherein the gripping iscontrolled by a feedback sensor
 12. A method as in claim 9 wherein thefirst portion comprises a middle portion of the arm.
 13. A method as inclaim 9 wherein the second portion comprises a top or bottom portion ofthe arm.
 14. A method as in claim 9 wherein an insert is coupled to thearm, wherein the first portion comprises a middle portion of the insert.15. A method as in claim 9 wherein an insert is coupled to the arm,wherein the second portion comprises a top or bottom portion of theinsert.
 16. A method as in claim 9 further comprising mating a pin onthe arm with a recess on the first or second component.